BGA visual inspection system
BGA visual inspection system
This is a completely new system with excellent operability and flexibility that allows for visual inspection of solder ball joints such as implemented BGA, uBGA, CSP, and Flip-Flop. The system can be set up in a short time and can be visually inspected as still images or videos through manual operation or stand-alone operation.
- Company：ニューリー・土山
- Price：Other
